Introducing the new KCM series: A new line - up of chip monolithic ceramic capacitors, equipped with metal pins, designed for automotive electronic devices unveiled

Introducing the new KCM series: A new line - up of chip monolithic ceramic capacitors, equipped with metal pins, designed for automotive electronic devices unveiled

5/16/2011

Murata Manufacturing Co., Ltd.

President/ Statutory Representative Director: Tsuneo Murata

Overview

Murata Manufacturing Co.,Ltd. is proud to announce that it has created a series of chip monolithic ceramic capacitors which feature metal pins and which are designed to be used in automotive electronic devices.

These capacitors will be showcased in Murata’s booth at the Automotive Engineering Exposition scheduled to be held at PACIFICO Yokohama starting on May 18.

Background

In the automotive market, the automakers, stimulated by the increasing interest focused in recent years on tackling global environmental problems and energy problems, have been pushing hard to develop hybrid electric vehicles (HEV) and electric vehicles (EV) and promote their practical use.

When chip monolithic ceramic capacitors (MLCC) - and especially large ones - are used in the automotive electronic devices installed on these HEVs and EVs, they are easily affected by the stress of the expansion and contraction of the substrates generated by sharp temperature changes, and under conditions where they will be exposed to thermal shock*1 occurring over long periods of time, measures to deal with solder cracks are an absolute necessity. Similarly, measures to deal with cracks in the capacitor elements that form as a result of vibration and mechanical impact must also be taken, and the capacitors are required to exhibit a higher level of reliability than when they are used in general - purpose products. So providing the capacitors with metal pins that have an elastic action reduces the impact to which the capacitor elements are subjected.

Features

  • The elastic action of the metal pins helps to reduce the amount of stress generated by thermal and mechanical impact and also makes the capacitors very reliable.
  • By stacking a pair of capacitors one on top of the other, less space is required for mounting, and a high level of capacitance is achieved.

Applications

DC - DC converters in automotive ECUs*2, etc.

Terminology

*1 Thermal shock: Sudden or abrupt changes in the ambient temperature
*2 ECU: Electronic control unit - the computer that electronically controls the devices or systems in a motor vehicle

Part Number

* "****" denotes a 4 - digit number provided by Murata.

Rated voltage
(DC)
Length (L)
x
width (W)
(mm)
Height (T) (mm) Temperature characteristics Static capacitance Static capacitance tolerance
Murata
model number
25V 6.1x5.3 3.7±0.2 X7R 22uF ±10% KCM55QR
71E226K****
6.1x5.3 6.4±0.3 X7R 47uF ±20% KCM55WR
71E476M****
35V 6.1x5.3 3.7±0.2 X7R 17uF ±10% KCM55QR
7YA176K****
6.1x5.3 6.4±0.3 X7R 33uF ±20% KCM55WR
7YA336M****
50V 6.1x5.3 3.7±0.2 X7R 10uF ±10% KCM55QR
71H106K****
6.1x5.3 6.4±0.3 X7R 22uF ±20% KCM55WR
71H226M****
63V 6.1x5.3 3.7±0.2 X7R 10uF ±10% KCM55QR
71J106K****
6.1x5.3 6.4±0.3 X7R 22uF ±20% KCM55WR
71J226M****
100V 6.1x5.3 2.8±0.2 X7R 4.7uF ±10% KCM55LR
72A475K****
6.1x5.3 4.8±0.2 X7R 10uF ±20% KCM55TR
72A106M****

Characteristics

Solder cracks generated by thermal stress reduced to a minimum

Test temperature: -55 to +125 degrees Celsius
Time left standing: 5 minutes at each temperature level
Substrate used: Glass epoxy substrate (FR - 4)

Superior solder crack resistance compared with discrete chips!

Chip size
Discrete chip
(5,750 size)
Capacitor with metal pins
(5,750 size)
1,000 cycles
Discrete chip/1,000 cycles
Capacitor with metal pins /1,000 cycles
2,000 cycles
Discrete chip/2,000 cycles
Capacitor with metal pins/2,000 cycles

Fig. 1 Comparison of solder cracks generated by thermal stress (liquid bath test)

Stress generated by substrate warping reduced

Fig. 2 Substrate warping test comparison

Fig. 2 Substrate warping test comparison

External Size

Fig. 3  Outline drawing (1 - level product)

Fig. 3 Outline drawing (1 - level product)

 Fig. 4  Outline drawing (2 - level product)

Fig. 4 Outline drawing (2 - level product)

* The height (T) differs from one model number to another. For further details, refer to the [Parts number table].

Production

Mass production scheduled to commence in July 2011

Others

Automotive Engineering Exposition 2011

Dates: Wednesday, May 18 to Friday, May 20
Venue: PACIFICO Yokohama
Murata booth No. : 222
URL: http://www.murata.com/event/autoee2011/index.html

Murata in Brief

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world. For more information, visit Murata's website at www.murata.com