By controlling materials at the molecular level before processing, molding, and firing them, ceramics come to possess superior electric characteristics. Since its founding in 1944, Murata has continued to develop electronic components which utilize the electric characteristics of ceramics. Through the application of its own unique know-how, Murata has established itself today as a global comprehensive manufacturer of electronic components. Acquisition of developmental capabilities and commitment to quality have led to the development and merchandising of many reliable and high-performance ceramic electronic components in the automotive electronics field.

Ceramic technology links each process together so intricately: material chemical composition and crystalline control, molding into optimal shape for specific features, firing to bring out electric characteristics of ceramics, manufacturing with full use of high-precision processing technology and circuit technology, analytical simulation and quality testing. That is why Murata goes all the way back to raw materials to produce additional new features.

Murata's several hundreds of ceramic materials include barium titanate and zirconium lead titanate. As ultra miniaturization of electronic components advances, in addition to chemical constitution, grain size and form of material particles have gained importance. Murata is currently aiming to establish grain control technology at nanometer levels by incorporating computational science approaches such as the finite element method, the Monte Carlo method and the molecular dynamics method.

Crystal formation and constitution of grain boundary change with firing time and temperature profile. These changes greatly affect electric properties such as its dielectric property and withstand voltage. Optimized firing profiles supported by scientific knowledge are one of Murata’s most important assets.

In order to produce superior electronic components, Murata has always explored special features, and has achieved smaller and more high-performance electronic circuits through the assembly and modularization of electronic components. In addition to the high-frequency technology that it cultivated over the years, Murata has introduced Bluetooth^® modules which utilize LTCC and DC-DC converters utilizing high-density packaging technology. Murata’s unique technologies not only make smaller electronic circuits possible, but also create modules that offer users merits such as improved dependability, reduced mounting space, and ease of design.

Murata’s unique capabilities and the circuit design technology which have yielded functional ceramic materials, layering technologies which have led to downsizing and advanced features, and the underlying supports of simulation, assessment, and measurement have all evolved with the production of high-frequency devices and electronic components. Murata’s communication modules and power modules have been made possible by the vertical integration of these diverse elemental technologies.

Murata has condensed necessary functions for short-range radio transmission into a package small enough to put on a fingertip. Using three-dimensional circuit design technology and ceramic multilayer technology, our superior radio-frequency material and components have been transformed. Past records show that Murata’s shipment of Bluetooth^® modules for cellular phones in 2005 surpassed all competitors’ around the globe.

Using its own highly reliable electronic components as well as unique design techniques and high-density packaging technology, Murata has achieved simple circuitry in its smaller, more efficient and power-saving converter. Its all-inclusive EMC technology also ensures the minimization of noise.