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While re-evaluation of the advantages of bulk mounting of chip components is currently underway, a new approach to the method for bulk packaging is required. The purpose is to improve total productivity in bulk mounting, including avoiding loss of components during conventional mounting (partial stock, and/or work-in-process components), adjusting to production plan changes, and so on. Murata, a pioneer in SMD/SMT, introduces a new packaging style, the "Bulk Pouch" in quick response to new board mounting requirements. |
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