When chip components are fed into the mounting machine using paper tape, fluff and dust from the tape may cause defects in solder joint of ultra-small components.
Embossed Tape, made of plastic, prevents this problem and allows for mounting of ultra-small chip components in a clean area, providing the flexibility to meet various board mounting requirements.
Provided by Shin-Etsu Polymer Co., Ltd.
Improves clearance of the cavity
Enlarged picture of embossed tape
Since the embossed tape causes less fluff and dust compared to the existing paper tapes, it improves clearance of cavity. This may solve pick-up problems on the mounting machine.
Provided by Shin-Etsu Polymer Co., Ltd.
Providing superior pick & place stability
Since Embossed Tape W4P1 causes no fluff and dust in packaging, it prevents the suction nozzle from clogging in the mounting process. This allows constant and stable suction of chips without frequent maintenance of the suction nozzle.
Paper fluff and dust measurement
