In order to reduce
environmentally hazardous substances, a shift to lead-free products is
necessary. With the "CERALOCK", since 1995, Murata has promoted
development of lead-reducing products by using lead-free materials in
plating and lead-free solder for internal connections.
With the previous wired-types (Through Hole Device) "CERALOCK",
lead-containing solder had been used for the terminal plating and the
internal connection. However, with the current CSALS/CSTLS series or
later models, plating for wires and solder for internal connections
does not contain lead. With the "CERALOCK" SMD, as with the
conventional SMD products, lead is not used for terminal plating on
electrodes and the joints between the inner electrodes and elements.
The piezoelectric elements contain a lead compound*. With the
"CERALOCK", while eliminating lead from the solder used for the
terminals and inner element/terminal connections, Murata has made
efforts to substantially reduce the lead content through
miniaturization of the products.
*: The present draft of the RoHS directive exempts the lead used in
these parts from the ban, because it is technically difficult to
substitute the lead in such parts with other materials. However, Murata
will continue to review possible lead elimination from such parts
through the research and development of relevant technologies. |
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 Surface mounting devices |
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Old: CSTCS_MX
(4.7 x 4.1 x 2.0mm) |
New: CSTCG_V
(2.0 x 1.3 x 0.95mm) |
Product size: Reduced by 93%
Content of lead compound: Reduced by 99% |
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Leaded components |
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Old: CST_MXW
(8 x 10 x 5mm) |
New: CSTLS_X
(7 x 7 x 4mm) |
Product size: Reduced by 51%
Content of lead compound: Reduced by 60% |
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| Recently, in keeping with the
trend toward lead-free products, some manufacturers are using
conductive paste as a substitute for solder in mounting some components
for automotive sets. For application of the conductive paste bonding
process, gold or silver-palladium is suitable as the electrode
material. Accordingly, components using gold or silver-palladium
electrodes are now in demand. Therefore, to meet the requirements for
the conductive paste bonding process, Murata's newly developed
components for automotive equipment use gold-plated electrodes. |
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Components for Automotive |
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| Conventional products |
New products |
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