Ceramic Capacitors FAQQWhat is the relationship between the land dimensions and the resistance to board bending of multilayer ceramic capacitors?

The “c” dimension in the figure below affects the strength of the resistance to board bending (deflection). When the “c” dimension is too large, more stress is applied to the multilayer ceramic capacitor (MLCC), diminishing the ability of the capacitor to resist board bending.
On the other hand, making the “c” dimension smaller than the width dimension of the capacitor can be said to be an effective way to increase the resistance to board bending.

In addition, making the “a” dimension between the electrodes larger than the external inter-electrode distance “g” dimension of the capacitor has the effect of increasing the resistance to board bending, although whether this effect is large or small is related to the solder resist pattern.
Also, this makes it easier to set the dimensions so that the desired insulation distance can be secured, even if the chip mounting position shifts and the distance between the land and electrodes becomes shorter.

<Dimensional diagram>

Note that other aspects of mountability should be confirmed before making use of the product.

Note: Guaranteed characteristics differ between products, so please review the delivery specifications and reference drawings of the specific product.
For more information on our main products, please check the detailed spec sheet on the product details pageDetailed specifications sheet
on the Murata website.

<Reference FAQ>
What is the allowable number of times and length of time for the soldering of chip multilayer ceramic capacitors?
Is it necessary to change the mounting conditions (e.g., the reflow conditions and land pattern conditions) when replacing with another series in the same size?

<Related Links>
Product Search　→　SMD / Lead type
Application manual -Board bending stress-
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