Increased Production of Communications Modules employing Component Embedding Technology

Increased Production of Communications Modules employing Component Embedding Technology

2/29/2012

Murata Manufacturing Co., Ltd.

President/ Statutory Representative Director: Tsuneo Murata

Overview

Murata Manufacturing Co., Ltd. will increase production of communications modules employing component embedding technology from March 2012.

Background and Details

The smartphone market is rapidly expanding, propelled by the surge in mobile Internet usage. It is necessary to reduce the space required for the fitting of electronic components in smartphones in order to ensure space for high-capacity batteries.

To enable us to respond to market demands for high-density layouts and small-outline components, Murata has developed a technology enabling high-density integration in an ultra-small package through the combination of component embedding technology and multilayer process technology (thin-layer LTCC* substrates) . Mass production of a smartphone power module employing this technology commenced in October 2011, and the total number shipped has now exceeded 500,000.

In addition, to enable us to accommodate the projected future expansion in demand for embedded modules, we intend to increase production from March 2012, in order to supply close-proximity wireless modules (Wi-Fi modules) and RF modules.

Features

  1. 10 layers can be formed on thin-layer LTCC substrates at a thickness of 200µm, presenting advantages for wiring efficiency, and enabling the realization of a low profile in the modules.
  2. Employs Murata's substrate-embedded monolithic ceramic capacitors
  3. Embedding of IC and peripheral SMD components reduces mounting area by 1/4 to 1/2.

Applications

Smartphones and other mobile devices

Part Number

LBEH5DKVMC

External Size

8.7mm (typ.) x 5.1mm (typ.) x 1.35mm (max.)

Production

Production is scheduled to be increased from March 2012 at Komatsu Murata Manufacturing Co., Ltd. (3-5 million units/month)

Terminology

* LTCC
(Low Temperature
Co-fired Ceramics) :
Normal electronic ceramics are fired at high temperatures (1,500°C and higher) . LTCC are fired at low temperatures (1,000°C or lower) , making it possible to employ silver or copper, which display low conductor resistance, for the internal wiring layers.

Murata in Brief

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. With annual revenues of ¥585 billion (~$7.1B USD) , Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world. For more information, visit Murata's website at www.murata.com