Mounting Space Reduced by between 25% and 50%!Commencing the Mass-Production of Combined Bluetooth®/Wi-Fi Modules Made Smaller with our In-house Internal Mounting Technology

Mounting Space Reduced by between 25% and 50%! Commencing the Mass-Production of Combined Bluetooth®/Wi-Fi Modules Made Smaller with our In-house Internal Mounting Technology

9/26/2012

Murata Manufacturing Co., Ltd.

President/Statutory Representative Director: Tsuneo Murata

Overview

Murata Manufacturing Co., Ltd. has commenced the mass-production of combined Bluetooth® (hereinafter known as BT) /Wi-Fi modules supporting Snapdragon™ S4 MSM8960 3G/LTE multi-mode processers*1 manufactured by Qualcomm Incorporated using internal mounting technology. The use of our in-house internal mounting technology has enabled us to reduce the mounting space of this module by between 25% and 50% over regular discrete modules.

This product will be placed on exhibit during CEATEC JAPAN 2012 held at Makuhari Messe, Chiba Prefecture, between October 2 and 6, 2012.

Background and Details

The rapidly-expanding smart phone market requires an increasing number of electrical components to be mounted into phones due to high-functionalization, and at the same time there is a growing demand for high-density components that require less space so that high-capacity batteries can be installed. In order to meet these market requirements, Murata Manufacturing has combined our in-house internal mounting technology and ceramic multi-layer technology (LTCC*2 boards) to establish circuit board technology that enables high-density mounting, and since March of this year we have been mass-producing between 5 million and 7million BT/Wi-Fi modules per month.

And, now we have also commenced the mass-production of BT/Wi-Fi modules supporting Snapdragon™ S4 MSM8960 3G/LTE multi-mode processers manufactured by Qualcomm Incorporated.

Features

  1. Low-back modules.
    We succeeded in forming thin-layer LTCC boards with a thickness of 200µm in ten layers to provide greater wiring efficiency within the module.
  2. Boards manufactured by Murata are mounted with built-in laminated ceramic condensers.
  3. Mounting space reduced by between 25% and 50%.
    Built-in ICs and the peripheral SMD devices in the board.
  4. Supports Snapdragon™ S4 MSM8960 3G/LTE multi-mode processers manufactured by Qualcomm Incorporated.

Applications

Aimed at smart phones, tablet PCs and other portable appliances.

Part number

LBDA6AYXFZ

External Size

6.8 (typ) x 5.0 (typ) x 1.4 (typ) mm

Production

Mass-production scheduled to commence at the Komatsu Murata Manufacturing Co., Ltd. from October 2012.

Sample Price

2,000 yen per unit

Terminology

*1 Qualcomm, Snapdragon™ S4 MSM8960 3G/LTE multi-mode processers: Qualcomm and Snapdragon are the trademarks of Qualcomm Incorporated registered in the United States of America and other countries.
*2 LTCC
(Low Temperature Co-fired Ceramics) :
Electronic ceramics are usually fired at temperatures of 1,500°C or higher, but LTCC boards are fired at a low 1,000°C or lower to enable silver and copper, which have low conductive resistance, to be used on the internal layer wiring.

Murata in Brief

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world. For more information, visit Murata's website at www.murata.com