Merits of Lead Attaching


SubTitleIcon6    Merits of Lead Attaching

- Measures against Deflection Cracking and Noise -

There are cases where the occurrence of deflection cracking and "noise" in chip components, can be solved by lead wires.

Lead wires absorb the stress from the board deflection, and prevent damage to the ceramic.
Lead wires absorb the stress from the board deflection,
and prevent damage to the ceramic.

Vibration of the ceramic is reduced by the lead wires, which decreases the vibration of the board.
Vibration of the ceramic is reduced by the lead wires,
which decreases the vibration of the board.

- Compatible to Flow Mounting -

When components with leads on one side are mounted to a board by flow soldering, there are cases where large sized chip components which are only compatible to reflow soldering can not be used.
In such a case, attaching lead wires to Murata's chip components, allows for mounting without changing the board.

Power supply board
Power supply board

- Boardless Mounting -


Components can be mounted where there are no boards, such as directly welding to metal frames or BUS bars.
In addition, by bending the lead wires, the mounting method can be set flexibly.

Lead Attaching Technology