A
The main cause of cracking is mechanical stress, such as the mechanical/thermal stress when mounting on a substrate and deflection of the substrate after mounting.
The following conditions can produce mechanical stress when mounting on a substrate.
The following conditions can produce thermal stress when mounting on a substrate.
The following conditions can produce mechanical stress after mounting.
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How do the stresses on an MLCC change depending on the line width of the printed circuit board? What are the effects of board flexing and the strain rate on cracking? Download free documents, based on tests and simulations performed by Murata, which describe the effectiveness of ways to inhibit MLCC cracking by changing the component layout and the manufacturing process design.
my Murata - Capacitor site “Application Manual -Board bending stress”
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*The article about clack of MLCC is here.
Strain Crack Mechanism and Preventive Measures for Multilayer Ceramic Capacitors