Murata today announced the LFD21891MMF3D931 high frequency matching device for use in sub-GHz 802.15.4 wireless Internet of Things (IoT) applications. Designed in collaboration with *1 and optimized for use with their Si4461 868 MHz*2 wireless transceiver IC, the matching device incorporates all the necessary components in an ultra compact package. Integrated in a low profile device measuring just 2.0 x 1.25 x 0.7 mm, the footprint is approximately 75 percent smaller than using traditional discrete components.
As the demand for IoT applications grows so does the need for engineers to quickly integrate wireless connectivity into their application. Typically requiring specialist knowledge in designing wireless circuitry, the availability of a transceiver together with an optimized matching device helps speed product design and engineering resources required.
Mass production of the LFD21891MMF3D931 will commence in October 2015.
*1…Silicon Labs is a leading provider of microcontroller, wireless connectivity, analog and sensor solutions for the Internet of Things.
*2…The transceiver IC supports the sub-1 GHz band (IEEE802.15.4). More information can be found .
Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world. For more information, visit Murata's website at www.murata.com