1. Fine grained high-density ceramic dielectric, pure
gold electrode and simple single layer structure
provide very reliable performance and excellent
2. A wide selection of sizes from very miniature
0.25mm square is suited to high-density mounting.
3. For compatibility with the gold electrodes, die
bonding with Au-Sn is possible and wire bonding
with gold wire is possible.
4. To improve handling of bonding, Au-Sn coating is
available on one side or both sides.
5. Custom made type (dimensions, cap. values, etc.)
are also available upon request.
1. Microwave Integrated Circuits
2. Microwave Devices
3. Optical Devices
4. Measuring Equipments