Summary of Lead Attaching Technology


SubTitleIcon6    Summary of Lead Attaching Technology

- Multiple Stacked Capacitors -

The center of the external electrodes of the multilayer ceramic capacitors (MLCC) tends to become convex shaped due to the coating method.
Therefore, it is difficult to properly attach the lead wires to multiple MLCC.
Murata has established the technology to attach the lead wires properly and securely to 2 stacked MLCC by utilizing specially formed lead wires.

Example of Attaching
Example of Attaching

3 Stacked and 4 Stacked Types (Production planned)
3 Stacked and 4 Stacked Types (Production planned)

- Microfabrication of Lead Wires -

This is an example of using a 1608 size MLCC as the capacitor element instead of a conventional plate capacitor.
The cut and bent guides of the MLCC are attached to flattened lead wires.
This structure allows for low cost processing, with a fewer number of materials to be used.

Microfabrication of Lead Wires

- Attching of Lead Wires to Small Size Chip Components -

As the size of chip components become smaller, the strength of the lead wires will become relatively stronger and as a result, the breaking and cracking of chips tends to occur during production. This problem has been solved by performing the attaching of lead wires and the resin coating process in a continuous line.
Accordingly, Murata is able to perform processing of the 1608 (in mm) / 0603 (in inch) size multilayer ceramic capacitor with leads, and the 1005 (in mm) / 0402 (in inch) size NTC thermistor.

Soldering lead wires to
chip components of 1.0mm x 0.5mm
Soldering lead wires to chip components of 1.0mm x 0.5mm

(Reference)
Size comparison with mechanical pencil
(Reference) Size comparison with mechanical pencil

NTC Thermistor (Temperature Sensor)

Lead Attaching Technology

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Merits of Lead Attaching
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Examples of Lead Attaching