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Held inside"Japan IT Week spring"

14th EMBEDDED SYSTEMS EXPO[ESEC]

Tokyo Big Sight Murata booth number:west 1-71 Wednesday,May 11-Friday,May 13

EMBEDDED SYSTEMS EXPO (ESEC) Exhibition

As networking of equipment progresses, needs are increasing for easier incorporation of wireless functions by using modules with embedded software. In addition to networking of electronic equipment, Murata Manufacturing Co., Ltd. will introduce its full range of support to help engineers cope with increased loads due to shorter development periods, from Wi-Fi® modules and wireless communication modules such as WiMAX to software. In addition, capacitors, inductors, and design support software that enable optimal power line design and module miniaturization will also be introduced.


We will introduce solutions that enable mounting of Wi-Fi® in various electronic equipment, including low-resource CPU and sensors in which Wi-Fi® has thus far been difficult to implement. In addition to demonstrating high-speed transfer using µitron realized by a Wi-Fi® module and embedded software, we will also demonstrate sensor networking and WiMAX communication.

Items in focus

  • Small, low profile Wi-Fi® module and a dedicated driver that supports various OS
  • All-in-one Wi-Fi® module for easier construction of sensor networks
  • Small WiMAX module (UQ-certified)

We will present methods of reducing the number of components such as replacement from aluminum electrolytic capacitors to chip monolithic ceramic capacitors and the use of power line capacitors. In addition, selection and evaluation of these components using design support simulation software will also be explained.

Items in focus

  • High capacitance chip monolithic ceramic capacitors
  • Ultra small chip monolithic ceramic capacitors
  • Low ESL chip monolithic ceramic capacitors
  • Ultra small film type inductors
  • Design support software ‹SimSurfing›

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