September 15, 2009
Murata Manufacturing Co., Ltd.
President/ Statutory Representative Director: Tsuneo Murata
Murata Manufacturing Co., Ltd. will exhibit their products and technologies at “CEATEC JAPAN 2009” held at Makuhari Messe in Chiba prefecture.
| Period | Tuesday, October 6th to Saturday, October 10th from 10:00 a.m. to 5:00 p.m. |
|---|---|
| Venue | Makuhari Messe in Chiba, City Hall 8 |
| URL | http://www.murata.co.jp/event/ceatec2009/index.html |
| Murata booth number | 8H34 |
| Theme | “Green × Electronics” |
Murata will introduce this year’s key devices and latest technologies in three areas. These include, “Environmental Products “Function Adding Products” and “Design Solving Products”, under the theme of “Green × Electronics.” The main stage will feature the introduction of the riding techniques of the bicycle riding robot, “Murata Boy” and the unicycle riding robot, “Murata Girl” as well as products and technologies contributing to ecology.
In the area of ecology, we will introduce products and technologies from the energy perspective. They include power supply modules to convert energy at high efficiency, capacitors and inductors assisting power lines with their low loss characteristics, and various electronic components contributing to energy saving in LED lighting systems and LCD TVs. Products and technologies contributing to clean energy technologies such as fuel cells and solar power generation will also be introduced.
We propose solutions for increasingly demanded equipment thermal protection from aspects of analytical simulation, overheat detection and cooling.
We will introduce a short-range wireless communication module combining connectivity in a simple compact system, as well as software to reduce its power consumption while enhancing throughput.
Murata’s sensor system captures various sensor device’s surrounding conditions and their changes, to signal processing, control circuits and software. Experience Murata’s user interface connection between you and your equipment.
We will introduce products and technologies contributing to space saving in equipment, such as built-in monolithic ceramic capacitor for substrates and device embedding technologies.
We propose solutions for enhancing bondability of substrates and eliminating squeals such as fail-safe designs, models accommodating conductive adhesives, and metal terminal models.
We introduce USB 3.0 noise measure models and ESD protection devices.
This is a PDF file. Adobe Reader is required to view, print, or download this file.
This document file is in RSS (XML) format. An "RSS reader" is required to read this file.
