February 23, 2012
Murata Manufacturing Co., Ltd.
President/ Statutory Representative Director: Tsuneo Murata
Murata Manufacturing Co., Ltd. has developed a wireless device compatible with the close-proximity wireless data transfer technology TransferJet™*The device is embedded with a next-generation IC and a Murata high-frequency filter (LFB214G48CGD471) .
*TransferJet™ is a trademark of Sony Corporation.
TransferJet™ is a technology developed to enable anyone to use close-proximity wireless data transfer easily and with no stress. TransferJet™ enables high volumes of music, image, movie and other data to be transferred at high speeds with ease simply by bringing two devices into proximity with each other. It is expected to have a bright future as a communications interface between mobile devices such as smartphones and digital cameras, and between mobile devices and PCs, TVs, etc.
Miniaturization of components is demanded as the functions of electronic equipment become increasingly sophisticated. The application of Murata's unique high-frequency design technology and component embedding and multilayer process technologies has enabled the development of a small, low-profile wireless device compatible with TransferJet™ standards.
The developed device employs a next-generation IC that does not require external ROM* or oscillators. This IC is embedded in a substrate using Murata's component embedding technology, enabling the realization of the industry's smallest dimensions. The device also incorporates a high-frequency filter and peripheral circuit components, reducing the space required for mounting.
| *ROM (Read Only Memory) : | Data storage media that can only be read |
|---|
Electronic devices, in particular smartphones, tablets, and notebook PCs
| Model name | FLECXAA-0075 |
|---|---|
| Center frequency | 4.48GHz |
| Communications band | 560MHz (4.2 - 4.76GHz) |
| Transmission speed | 375Mbps (Maximum effective rate) |
| Connection form | 1-to-1 |
| Transmission distance | Within several cm (When using Murata antenna coupler) |
| External dimensions | 5.3 x 5.3 x 1.0mm |
| Host I/F | SDIO (3.0) |
(Specifications refer to product in development)
| Early April 2012 | Commencement of production of samples |
|---|---|
| Summer 2012 | Commencement of mass production |
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