• Proposal of New Tape Packaging
  • Bulk Pouch
  • Embossed Tape
  • Bulk Feeding System

New Product Information

New product information on the featured Murata capacitors.
Murata is challenging product development to meet customer needs.

Examples of Problem Solving

Solving customers' problems.

Other Examples of Problem Solving

Examples of Noise Countermeasures

Industry Pickup

Pickup of industries attracting attention! Introducing the recommended series and the latest information on Murata for each industry.

Other Industry Application Guides

• Mobile Phones
• PC

• Television
• White Goods

Circuit Designs Best Suited to Bulk Feeding

To maximize the benefits generated by using the bulk feeding system, it is important to consider the process from the circuit design stage.

Unify the component size to "0402C" or "0603C".

• Unifying the component size enables only a single kind of bulk feeder to be used. This makes it easier to control the bulk feeding system.
• For "0805C" or larger sized components, the component thickness will vary, requiring two or more bulk feeders. Because "0402C"- or "0603C"-size components have the same size and shape, one type of bulk feeder can be applied to a wide variety of products. For such small sized chip monolithic ceramic capacitors, our company offers various products ranging from those with minute capacitance to those with large capacitance. Contact us for details.

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Unify the capacitance value to "E1 step".

• As far as possible, use components that have the same capacitance value and temperature characteristic. If these values are standardized, great effects can be achieved when using the bulk feeding system.
  By using many "E1 step (*)" group products, whose unit price is relatively low, the cost of equipment production can be dramatically reduced.

Do not specify the packaging style in the circuit design stage.

• If the packaging style is specified in the circuit design stage, taping-packaged components cannot be changed to bulk-packaged ones in the mounting process. Likewise, bulk-packaged components cannot be changed to taping-packaged ones either. If specifying only taping packaging as the packaging style, the bulk feeding system cannot be used in the mounting process. And if specifying only bulk packaging as the packaging style, taping-packaged components cannot be used if problems occur during bulk feeding. By not specifying the packaging style in the circuit design stage, greater flexibility is possible because the packaging style can be selected during the mounting process based on the situation.