To enhance the technical advantages of communication equipment, Murata offers miniaturized, sophisticated components and modules for the demands of many applications.
Isolators, GaAs Switch IC, RF Diode Switches, Baluns (Chip Multilayer, Wire Wound/Film type), Couplers (Chip Multilayer, Film type), Chip Multilayer Components (hybrid dividers and diplexers), High Frequency Coaxial Connectors, Thin Film Circuit Substrate "RUSUB®", Single Layer Microchip Capacitors and Wi-Fi®/Bluetooth®/One-seg Modules are offered.
|Sep 26, 2012||Mounting Space Reduced by 70%! Development of Multi-Channel Power Management Module Made Smaller with our In-house Internal Mounting Technology|
|Sep 26, 2012||Mounting Space Reduced by between 25% and 50%! Commencing the Mass-Production of Combined Bluetooth®/Wi-Fi Modules Made Smaller with our In-house Internal Mounting Technology|
|Sep 18, 2012||The world's smallest! Low current consumption! Mass production of transmission modules for smartphones now underway|
|May 29, 2012||Start of Bluetooth® SMART Module Mass Production —LBCA2ZZVZE—|
|Feb 29, 2012||Increased Production of Communications Modules employing Component Embedding Technology|
|May 13, 2013||Update of data of Murata Product Search Engine|
|Apr 15, 2013||Update of [Design Tool "SimSurfing (WEB)" ]|
|Apr 15, 2013||Update of [Design Tool "SimSurfing (DL)"]|
|Mar 29, 2013||Update of [Design Tool "SimSurfing (WEB)" ]|
|Mar 29, 2013||Update of [Design Tool "SimSurfing (DL)"]|
PDF files of product catalog and product technical information.
We introduce of Bluetooth® Smart module.