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    Silicon Capacitors

    Silicon CapacitorsX2SC / XBSC / UBSC / BBSC / ULSC Series

    Ultra broadband surface mounted capacitor up to 220GHz

    The X2SC / XBSC / UBSC / BBSC / ULSC Capacitors target optical communication systems (ROSA /TOSA, SONET and all optoelectronics) as well as high speed data systems or products. These capacitors are designed for DC blocking, coupling and bypass grounding applications. The unique technology of integrated passive devices in silicon developed by Murata* offers low insertion loss, low reflection and high phase stability from 16 kHz up to more than 200 GHz for the X2SC, up to more than 100 GHz for the XBSC, up to more than 60 GHz for the UBSC, up to 40 GHz for the BBSC and up to 20 GHz for the ULSC. These deep trench silicon capacitors have been developed with a semiconductor MOS process. They provide very high reliability and capacitance stability over voltage (0.1% / V) and temperature (70 ppm / K).

    They have an extended operating temperature range from −55 to 150°C. Reliable and repeatable performances areobtained thanks to a fully controlled production line with high temperature curing (above 900°C) generating a highly pure oxide. The X2SC / XBSC / UBSC / BBSC / ULSC series are compliant with standard JEDEC assembly rules, making theproduct fully compatible with high speed automated pick-and-place manufacturing operations. These capacitors areRoHS-compliant and are available either with ENIG terminations or lead-free prebumping depending on the case size.

    *Murata Integrated Passive Solutions

    Assembly notes

    Key features

    • Ultra-broadband performance higher than  220 GHz
    • Resonance free allowing ultra-low group delay variation
    • Ultra-low insertion loss thanks to an excellent impedance matching in transmission mode (AC-coupling)
    • Low ESL and low ESR in bypass grounding mode (DC-decoupling)
    • High stability of capacitance value over temperature, voltage and aging
    • High reliability, longer life time (over 10 years) (100x better than MLCC)
    • Same Coefficient of Thermal Expansion (CTE) as active dies
    • Compatible with lead free reflow soldering, Straight forward assembly process specially with SAC305 pre bumped version
    • Larger integration flexibility (i.e. embedding)

    (Please refer to our assembly note for more details)

    Specification

    Swipe left or right to change screens View in landscape mode
    Frequency Series name 0201M 0201 0402 0603
    BV30 BV30 BV30 BV11 BV11 BV30 BV30 BV30 BV11 BV30 BV11 BV11
    1nF 5.6nF 10nF 10nF 22nF 1nF 10nF 22nF 47nF 47nF 100nF 100nF
    Up to 100GHz+ XBSC - Click Click Click Click - - Click Click - - -
    Up to 60GHz+ UBSC Click Click Click Click Click Click Click Click Click Click Click -
    Up to 40GHz+ BBSC Click Click Click Click Click Click Click Click Click Click Click -
    Up to 20GHz+ ULSC Click Click Click Click Click Click Click Click - Click Click Click

    Specification

    Swipe left or right to change screens View in landscape mode.
    Parameter Value
    X2SC 200GHz+ XBSC 100GHz+ (*1) UBSC 60GHz+ (*1) BBSC 40GHz (*1) ULSC 20GHz (*1)
    Capacitance range 1nF to 22nF (*2) 1nF to 47nF (*2) 1nF to 100nF (*2) 1nF to 100nF (*2) 1nF to 100nF (*2)
    Capacitance tolerances ±15% (*2)
    Mounting Method Solder surface mounting (*7)
    Operating temperature range −55°C to 150°C
    Storage temperature range −70°C to 165°C (*3)
    Temperature coefficient +70 ppm / K
    Rated Voltage (RV) 3.8V to 16V (*9)
    Breakdown Voltage (BV) 11VDC to 30VDC (*8)
    Capacitance variation versus RVDC 0.1% / V (from 0V to RVDC)
    AC-coupling
    (transmission mode)    		 Insertion Loss (IL) @20GHz,
    +25°C    		 0.1 dB (*4) 0.1 dB (*4) 0.1 dB (*5) 0.1 dB (*5) 0.2 dB (*6)
    @40GHz,
    +25°C    		 0.1 dB (*4) 0.2 dB (*4) 0.2 dB (*5) 0.2 dB (*5) 0.3 dB (*6)
    @60GHz,
    +25°C    		 0.2 dB (*4) 0.3 dB (*4) 0.3 dB (*5) (0.4 dB)
    (WC & < 0201 case size)    		 (0.5 dB)
    (WC & < 0402 case size)
    @100GHz,
    +25°C    		 0.2 dB (*4) 0.5 dB (*4) (0.7 dB) (WC) (0.8 dB)
    (WC & < 0201 case size)    		 -
    @200GHz,
    +25°C    		 0.5 dB (*4) (0.8 dB) (WC) (0.9 dB)
    (WC & < 0201M case size)    		 - -
    Return Loss (RL) Up to 100GHz, +25°C > 20 dB (WC)
    Up to 200GHz, +25°C > 15 dB (WC)
    DC-decoupling
    (reflection mode)    		 Equivalent Series Inductance (ESL) @+25°C,
    SRF shunt mode    		 - - - - Typ. 100 pH
    Equivalent Series Resistance (ESR) @+25°C,
    SRF shunt mode    		 - - - - Typ. 300 mOhm
    Insulation resistance @RV, +25°C, 120s > 10 GOhm
    Aging Negligible, < 0.001% / 1000h
    • WC = worst case
    • (*1)Performances are guaranteed up to this limit. Component might be used above this limit with degraded performances.
    • (*2)Other values on request.
    • (*3)w/o packing
    • (*4)e.g. 2.2nF / 01005M / BV 11V
    • (*5)e.g. 22nF / 0201M / BV 11V
    • (*6)e.g. 47nF / 0201 / BV 11V
    • (*7)Please check the assembly note for the mounting methods of each product.
    • (*8)See the FAQ here for the relationship between breakdown voltage and rated voltage.
    • (*9)10 years of intrinsic life time prediction at 100°C continuous operation.

    Dimension

      Series
    X2SC XBSC UBSC BBSC ULSC
    Case size 01005M [0.4×0.2mm]
    to
    0201M [0.6×0.3mm]    		 01005M [0.4×0.2mm]
    to
    0201 [0.8×0.6mm]    		 01005M [0.4×0.2mm]
    to
    0402 [1.2×0.7mm]    		 01005M [0.4×0.2mm]
    to
    0402 [1.2×0.7mm]    		 01005M [0.4×0.2mm]
    to
    0603 [1.8×1.1mm]
    Thickness 100 µm 100 & 400 µm 100 & 400 µm 100 & 400 µm 100 & 400 µm
    Image of dimension

    Product Lineup

    XBSC Series (Up to 100GHz+)

    Refer to this FAQ regarding the relationship between voltage tolerance and rated voltage.
    See the FAQ here for the part numbering.

    UBSC Series (Up to 60GHz+)

    Refer to this FAQ regarding the relationship between voltage tolerance and rated voltage.
    See the FAQ here for the part numbering.

    BBSC Series (Up to 40GHz+)

    Refer to this FAQ regarding the relationship between voltage tolerance and rated voltage.
    See the FAQ here for the part numbering.

    ULSC Series (Up to 10GHz+)

    Refer to this FAQ regarding the relationship between voltage tolerance and rated voltage.
    See the FAQ here for the part numbering.

    Key applications

    • Optoelectronics / high-speed data
    • Trans-Impedance Amplifiers (TIA)
    • Receive-and-Transmit Optical Sub-Assembly (ROSA / TOSA)
    • Synchronous Optical Networking (SONET)
    • Consortium for On-Board Optics (COBO) modules
    • Co-Packaged Optics (CPO) and Pluggables
    • Near Packaged Optics (NPO)
    • Silicon Photonics (SiPh) optical transceiver
    • High-spec IC (like DSP)
    • High speed digital logic
    • Broadband test equipment
    • Broadband microwave / millimeter wave
    • Replacement of X7R and NP0 capacitors
    • Recommended capacitor solution evidenced by ESA  certification
    • High volumetric efficiency (i.e. capacitance per unit volume)
    • Low profile applications (400 or 100µm)

    Substrate Design Support Tool

    Silicon capacitor Matched Line

    Substrate Design
    Support Tool

    Assembly of Broadband Silicon Capacitors: Guidelines for improved Impedance Matching

    UPDATE
    2020/08/11
    Download PDF

    Assembly Note

    Please check the assembly note for the mounting methods of each product.

    Assembly Note Silicon Capacitor_Assembly by reflow (PDF: 1.1 MB)

    UPDATE
    7/8/2021
    Download

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