Silicon CapacitorsWBSC / WTSC / WXSC Series

Wire-bondable vertical capacitor up to 250℃

The Murata* WBSC / WTSC / WXSC Capacitors are dedicated to applications where reliability up to 250℃ (for WXSC) is the main parameter. They are suitable for DC decoupling. The unique technology of integrated passive devices in silicon developed by Murata can solve most of the problems encountered in demanding applications. These Si capacitors in ultra–deep trenches have been developed with a semiconductor process which enables the integration of high capacitance density from 6nF/mm² to 250nF/mm² (with a breakdown voltage of respectively 150V to 11V). Our SiCap technology features high reliability - up to 10times better than alternative capacitors technologies - thanks to a full control of the production process with high temperature curing (above 900℃) generating a highly pure oxide. This technology provides industry leading performances relative to the capacitor stability up to 250℃ for WXSC, up to 200℃ for WTSC and up to 150℃ for WBSC with a temperature coefficient equals to +60 ppm/K. In addition, intrinsic properties of the silicon show a low dielectric absorption and a low to zero piezo electric effect resulting in no memory effect. This Silicon based technology is ROHS compliant.

*Murata Integrated Passive Solutions

Go here to confirm assembly notes for each product.

Key features

  • Low profile 250µm.
  • Low leakage current.
  • High stability (temperature and voltage).
  • Negligible capacitance loss through aging.
  • Compatible with standard wire bonding assembly (ball and wedge).

(please refer to our assembly note for more details)

Key applications

  • Any demanding applications such as radar, aerospace, wireless infrastructure communication, data broadcasting, automotive…
  • Applicable for standard wire bonding approach (ball and wedge), easier than MLCC, thanks to a perfect pad flatness.
  • Decoupling / DC noise and harmonic filtering / Matching networks (e.g: GaN power amplifier, LDMOS).
  • High reliability applications.
  • Downsizing.
  • Low profile applications (250µm).

WBSC / WTSC / WXSC series Specification

Parameter Value
Capacitance range 100pF to 22nF(*)
Capacitance tolerances ±15%(*)
Mounting Method Wire-bonding vertical(*4)
Operating temperature range -55°C to 250°C for WXSC
Storage temperature range -70°C to 265°C(*2) for WXSC
Temperature coefficient +60ppm/K
Breakdown Voltage (BV) 11V, 30V, 50V, 150V(*)(*5)
Capacitance variation versus 0.02%/V (from 0 to RVDC)
Equivalent Series Inductor (ESL) Typ 50pH @ SRF (*3)
Equivalent Series Resistor (ESR) Max 50mΩ (*3)
Insulation resistance 10GΩ @ RVDC @ 25°C t>120s for 10nF
Aging Negligible, < 0.001% / 1000h
Capacitor height 250µm
  • (*) Other values on request
  • (*2)w/o packing
  • (*3)with wire-bonding de-embedded
  • (*4)Please check the assembly note for the mounting methods of each product.
  • (*5)See the FAQ here for the relationship between breakdown voltage and rated voltage.

WBSC Series

Refer to this FAQ regarding the relationship between voltage tolerance and rated voltage.
See the FAQ here for the part numbering.

WTSC Series

Refer to this FAQ regarding the relationship between voltage tolerance and rated voltage.
See the FAQ here for the part numbering.

WXSC Series

Refer to this FAQ regarding the relationship between voltage tolerance and rated voltage.
See the FAQ here for the part numbering.

Assembly Note

Please check the assembly note for the mounting methods of each product.

Assembly Note Silicon Capacitor_Assembly by wirebond (PDF: 2.0 MB)

UPDATE
01/12/2023