Wi-Fi® + Bluetooth® ModulesType 1LV

Order Number LBEE59B1LV

  • inproduction
  • recommended
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Overview

Shielded Ultra Small Dual Band Wi-Fi® 11a/b/g/n + Bluetooth® 5.0 Module
  • 2.4GHz & 5 GHz Wi-Fi® + Bluetooth® Module
  • Chipset: Infineon (CYW43012)
  • Processor: No
  • FCC/IC "Reference" Certified
High Performance Capabilities for Internet of Things
  • For Industrial IoT, Smart Home, Sensor Network, Gateway
  • 802.11 a/b/g/n 78Mbps
  • NXP i.MX Linux, Infineon WICED

Description

Type 1LV is a small and high performance module based on Infineon CYW43012 combo chipset which supports Wi-Fi® 802.11a/b/g/n + Bluetooth® 5.0 BR/EDR/LE up to 72.2Mbps PHY data rate on Wi-fi® and 3Mbps PHY data rate on Bluetooth®. 2Mbps LE PHY is also supported. The WLAN section supports SDIO v2.0 SDR25 interface and the Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data.

In IEEE 802.11ac-friendly mode, the WLAN operation supports MCS8 (256 QAM) in 20MHz channel for data rate up to 78Mbps.

The CYW43012 implements highly sophisticated enhanced collaborative coexistence hardware mechanisms and algorighms, which ensure that WLAN and Bluetooth® collaboration is optimized for maximum performance.

Embedded IPv6 network stack for use with WICED SDK and TCP keepalive is handled internally, so that host processor can keep sleeping.

In addition to Bluetooth® 5.0 2Mbps PHY support, all of optional Bluetooth® 4.2 features, LE Secure Connections, LE Privacy 1.2 and LE Data Packet Length Extension, are supported.

Type 1LV module is packaged in an impressively small sheilded form factor that facilitates integration into size- and power-sensitive applications such as IoT applications, handheld wireless system, gateway and more.

Specs

Documents

Document Statement If you use NXP i.MX platforms for Linux, please check Wi-Fi®/Bluetooth® Modules for NXP i.MX for supported combination.

Products Data Sheet

Last Update: Mar 25, 2021

Products Related Files

If you would like a product catalog or technical data, please check the check box and download it from the download button below.

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Type File Name File size Last Update
Product Brief type1lv-brief.pdf PDF: 698KB -
Additional Docs type1lv_hw_application_note.pdf PDF: 1.11MB -
type1lv_module_footprint_topview.dxf DXF: 48KB -
type1lv_antenna_design_guide.pdf PDF: 506KB -
type1lv_antenna_p2ml6906.dxf DXF: 253KB -
murata_wifi_bt_fcc_guide.pdf PDF: 1.09MB -

Software

Software

WICED™ is a Infineon development system that vastly reduces the effort required to add wireless connectivity to embedded devices. The SDK enables developers to quickly create network connected applications targeted for low-resource microcontrollers.

The WICED™ SDK includes:

  • An open source build system and toolchain based on GNU make.
  • A GUIDE based on Eclipse CDT that seamlessly integrates with a programmer and single-step, thread-aware, debugger based on OpenOCD and gdb.
  • A complete software stack that includes advanced security and networking features such as SSL/TLS, IPv4/IPv6 networking, and mDNS/Bonjour.
  • Production ready example applications.
Driver Firmware Linux driver/firmware for NXP i.MX platform
RTOS driver/firmware for Infineon WICED

Block Diagram

Block Diagram : Type 1LV

Eval Tool

Evaluation Tool

Purchase

Order Number LBEE59B1LV
Production Part Number LBEE59B1LV-278
Purchase

Please check distributor inventory for 1LV module.
Please check distributor inventory for 1LV M.2 module.
No annual volume requirement for purchasing from distributors.

Please engage with Murata sales team and wireless team to determine if this module is suitable for your applications.

Murata reserves the right to support or not to support requests based on the corporate policy that includes export control and application restrictions, annual volume requirement (100kpcs) or other requirements.

To expedite the qualification of your application for these modules, please submit the information through the Contact Us button on the top.

Order Increment 2,000

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