Remote SIM provisioning in low-power cellular modules for IoT/M2M devices enabled by Murata and Truphone collaboration

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20/02/2019

Murata to reveal details at MWC19 in Barcelona 

Barcelona, Spain and Hoofddorp, Netherlands: An industry-changing collaboration between Murata and Truphone is announced, which will see the companies combining their technologies and services in order to take a lead in the eSIM revolution for the Internet of Things (IoT) and Machine-to-Machine (M2M) devices.

The two companies are working at the forefront of transformative technologies. Murata is advancing a variety of IoT applications and has developed a low-power cellular module for IoT/M2M devices. These modules lower battery consumption, make space for device makers and reduce the cost of production.

The low-power Murata module incorporates ST Microelectronics’ ST33 M2M eSIM which is a fully compliant GSMA solution suitable for remote SIM provisioning. At 2x2mm, the wafer level chip scale package (WLCSP) that the eSIM comes in is a remarkably small SIM card, paving the way for ever-smaller devices that are less prominent and provide a more seamless integration into their operating environment.

Truphone’s role has been to enable the module to connect out of the box to low-power wide-area technologies across numerous countries via its market-leading bootstrap connectivity technology implemented by the GSMA. In addition, the company has supplied its GSMA-accredited M2M remote SIM-provisioning application that, when integrated with the bootstrap connectivity, enables the device to obtain a SIM profile from other mobile operators allowing for continuous local connectivity.

Jim Philipp, Senior Marketing Manager at Murata said: “The world of IoT devices is broad and complex, and especially so for narrow-band technologies. With this module, and the integration of technology from Truphone and ST, we’re simplifying the supply chain for anyone in the IoT market who wants powerful connectivity, cost-saving hardware and a geographical footprint to keep up with their business.” 

Steve Alder, Chief Business Development Officer at Truphone said: “One barrier to mass adoption of IoT is the complexity device makers face in connecting their devices. This collaboration with Murata brings together all the elements, packaged together in a way that allows device makers to get connected simply and efficiently. With Truphone’s global bootstrap connectivity and remote SIM provisioning, device makers can manufacture a single worldwide model type for the globe, and then configure the device over the air to allow it to connect locally, wherever it is unboxed.”
Murata in Brief

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world. For more information, visit Murata's website at www.murata.com