Murata introduces RF submodule for Wi-Fi

  • Connectivity Modules


Murata Manufacturing Co., Ltd.
President/Statutory Representative Director:
Tsuneo Murata


Murata Manufacturing Co., Ltd. started in April the mass production of RF sub-modules for Wi-Fi*1.
This product uses Murata semiconductor design technology, monolithic ceramic technology, and circuit design technology to reduce the size of the front end circuit in order to incorporate the Wi-Fi function. This enables reduction of the component surface mount area and decreasing of component contact points in comparison to circuits with the former discrete structure.


Wi-Fi is loaded as a standard function on smartphones these days, and the supporting frequency band increasingly uses the 5GHz band rather than just the former ISM 2.4GHz band. In addition, transmission speeds have improved with recent communications methods by use of spatial multiplexing, and investigation of a 2x2-MIMO*2 structure with high-end smartphones has begun. Accompanying these trends there is a concern about an increase in front end circuit complexity, additional contact points, and greater surface mount area, in comparison to former structures. Murata has implemented its original monolithic ceramic technology and semiconductor design technology to create an RF submodule that incorporates the structural components required by the front end circuit.
This greatly reduces the component mounting area and decreases the component contact points in comparison to circuits with the former discrete structure, saves area for customer design, and contributes to design resources and shortens development cycles.


  • Compliant with Wi-Fi 2.4G、5GHz IEEE802.11a/b/g/n/ac*3.
  • Incorporates required structural elements such as PA, LNA, RF switch, filter, duplexer and coupler.
  • Compatible with Qualcomm Atheros made WCN3990 chip set.


Mobile devices such as smartphones and tablet PCs.

Part number


External size

3.0x3.0x0.9max mm

Explanation of terms

*1. Wi-Fi: The standard name for wireless LAN, Wi-Fi enables connection of smartphones, portable devices, televisions, computers and game consoles to a LAN (Local Area Network).
*2. MIMO stands for Multiple-Input and Multiple-Output, a technology that improves communications speed by using multiple transceiving antennas. LTE is starting to be used in wireless LAN.
*3. IEEE802.11a/b/g/n/ac: The IEEE (US Institute of Electrical and Electronics Engineers) communications standard for Wi-Fi.

Murata in Brief

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world. For more information, visit Murata's website at