1. Bond Metal Terminals to External Electrodes of Chips
This product has high resistance to heat and mechanical impact and greatly reduces acoustic noise of boards by ceramics.
2. Stacking of Chips
Achieve high capacity by stacking 2 capacitors.
3. Adopted Low Dielectric Constant Materials
Improved effective capacity and ripple resistant performance, compared to conventional products (X7R characteristics).
4. 2 chips can be stacked.
Realize large capacity by stacking 2 capacitors.