Sound Components (Buzzer)Pin Type Piezoelectric Sounders: Request to Comply with the Soldering Conditions

Guideline concerning soldering

Applicable Series
PKM Series (PIN type)

Please review our stipulated soldering conditions (*).

If the peripheral support condition of the vibration plate changes, the sound pressure level may decrease.

How the failure occurs

The protruding part of the rear cover is designed to fit into the depression of the casing, in order to maintain the peripheral support condition. The product is designed so that the resonance frequency determined by the peripheral support condition enables the optimum sound pressure level to be obtained.

If the product is exposed to a higher temperature or for a longer time than our stipulated soldering condition values (*), it is conceivable that the casing and the rear cover may change in size, resulting in a change in the peripheral support condition of the diaphragm. If this occurs, the resonance frequency will shift to a lower frequency, causing the frequency corresponding to the sound pressure peak to fall.
In some cases, it may fall below the sound pressure level indicated in the delivery specifications for the defined frequency (2khz, 4khz, etc.).

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* Soldering conditions
Flow soldering Molten solder temperature: +260°C±5°C
Time: Within 10±1 seconds
Pins minus 1.5 mm protruding from the pin exit on the rear cover
Soldering iron Tip temperature: 350±5°C
Soldering time: 3.0±0.5 seconds
Pins minus 1.5 mm protruding from the pin exit on the rear cover.

Construction

Sound pressure frequency characteristics

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  3. Precautions for use of Sound Components