EMSC Series

Wire-bondable or embedded low profile capacitor down to 100µm

Thanks to the unique Murata* Silicon capacitor technology, most of the problems encountered in demanding applications can be solved. The wire bondable or embedded low profile Silicon Capacitors are available with thicknesses of 100µm (down to 80µm on request) and are the most appropriate solution for embedded applications, when designers are looking at utmost decoupling behaviours. EMSC are optimized for laminate substrate package, rigid / flex PCB, FR4, ceramic, glass, leadframe or foil platforms. The Silicon capacitor technology offers a capacitor integration capability (up to 250nF / mm²) which allows downsizing compared with existing solutions. The Murata technology features high reliability, up to 10times better than alternative capacitor technologies, such as Tantalum or MLCC, and eliminates cracking phenomena. Silicon Capacitor technology also offers a very stable capacitor value over the full operating voltage & temperature range, with a high and stable insulation resistance. This Silicon based technology is ROHS compliant and can be compatible with lead free reflow soldering process.

*Murata Integrated Passive Solutions

Murata Icon X Key features

  • Ultra Low profile 100µm (80µm on request).
  • High stability (temperature, voltage and aging).
  • Low ESL and ESR.
  • Low leakage current.
  • High reliability.
  • Embedding or wire-bonding solutions
(please refer to our Assembly Application Note for more details)

Murata Icon X Key applications

  • Any demanding applications, such as medical, aerospace, automotive industrial…
  • Supply decoupling / filtering of active device
  • High reliability applications
  • Devices with battery operations
  • Volume limited applications

Murata Icon X EMSC series Specification

Parameter Value
Capacitance range 390pF to 1µF
Capacitance tolerances ±15%(*)
Operating temperature range -55°C to 150°C
Storage temperature range -70°C to 165°C(*2)
Temperature coefficient +60ppm/K
Breakdown Voltage (BV) 11VDC or 30VDC
Capacitance variation versus RVDC 0.1%/V (from 0 to RVDC)
Insulation resistance 100 GΩ @ 3V, @ 25℃, t>120s, for 100nF
Aging Negligible, < 0.001% / 1000h
Reliability FIT<0.017 parts / billions hours
Capacitor height 100µm(*3)

(*) Other values on request (*2) w/o packing(*3) 80µm thickness on request

Murata Icon X Series Lineup

EMSC.xxx
Wire-bondable or embedded low profile Si Cap
from -55℃ to 150℃
Part number Capacitance BV
Case size Thickness
935123730510-xxA 10nF 30V 0202 100µm
935123421610-xxA 100nF 11V 0404 100µm
935123733610-xxA 100nF 30V 0605 100µm
935123422622-xxA 220nF 11V 0505 100µm
935123424710-xxA 1µF 11V 1208 100µm

For other values, contact your Murata sales representative.

Murata Icon X PDF Catalog

PDF documents related to silicon capacitors can be downloaded below

Commercial leaflet_EMSC V4.4_Murata (PDF: 1.0 MB)

  • UPDATE 20/2/2018
Download PDF

Assembly Note EMSC V1.9_Murata (PDF: 0.6 MB)

  • UPDATE 2/2/2018
Download PDF