CAD dataMultilayer Ceramic Capacitors - Footprint Data

PLEASE CAREFULLY READ THE FOLLOWING RESTRICTIONS BEFORE USING DATA ABOUT THE PRODUCTS ("DATA").
IF YOU DO NOT AGREE TO THE RESTRICTIONS, PLEASE DO NOT USE THE DATA. USE OF ANY PART OF THE DATA INDICATES YOUR COMPLETE AND UNCONDITIONAL ACCEPTANCE OF THE RESTRICTIONS SET FORTH BELOW.

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Restrictions on the use of the DATA

  1. You shall not use the DATA for any purpose other than wiring pattern design by using CAD software.
  2. The DATA is provided on an "AS IS" basis without warranty of any kind, either express or implied, including but not limited to the implied warranties of merchantability, fitness for a particular purpose and non-infringement of third party rights.
  3. Murata Manufacturing, Co., Ltd. ("Murata") shall not be liable for any damages, including but not limited to any lost profits, lost savings or other incidental or consequential damages, arising out of or relating to the use of or inability to use the DATA, regardless of any notice of the possibility of such damages, or for any claims made by any third party.
  4. The DATA is subject to change from time to time or products may be discontinued without notice. Please check the latest version.
  5. You acknowledge and agree that the ownership and all intellectual property rights (including but not limited to copyright) of the DATA are held by Murata. You shall not redistribute or reproduce the DATA without prior consent of Murata.
  6. For details about a product, please refer to Murata catalog or approval specifications for the product.
Applicable condition of the DATA for footprint data.
  • Our footprint data on this page are based on reference values . Therefore, please confirm the proper value with these values by using your actual equipments.
  • The DATA may include the data for discontinued products. Please contact us about the latest production status.

Last Update 7/12/2017

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Application Series File size
For General GRM General purpose products ZIP: 12.4MB
GR3 High effective capacitance and high allowable ripple current ZIP: 0.1MB
LLL LW reversed low ESL type ZIP: 0.1MB
LLR Controlled ESR low ESL type ZIP: 0.1MB
GJM High Q type for high frequency ZIP: 3.5MB
GQM High Q type for high frequency and high power ZIP: 1.4MB
GJ8 Acoustic noise reduction type ZIP: 0.1MB
GRM Only for LCD backlight inverter circuit ZIP: 0.1MB
GJ4 Audio signal low distortion type ZIP: 0.1MB
GA2 Based on the electrical appliance and material safety law of Japan ZIP: 0.1MB
GA3 Acquired certifications of IEC60384-14 Class Y3 and UL60950-1 ZIP: 0.1MB
GR4 For Ethernet LAN and primary-secondary coupling of DC-DC converters ZIP: 0.1MB
GR4 For Splitter Circuit of G-Fast and xDSL ZIP: 0.1MB
GR7 Product limited to camera flash units ZIP: 0.1MB
GRJ Resin external electrode type ZIP: 0.3MB
ZRB Acoustic noise reduction type of interposer substrate (Chip ≧ interposer substrate) ZIP: 0.1MB
For Automotive GCM For automotive ZIP: 2.2MB
GC3 For automotive, high effective capacitance and high allowable ripple current ZIP: 0.1MB
GCJ Resin external electrode product ZIP: 0.5MB
GCD Specially designed product to reduce shorts ZIP: 0.1MB
GCE Resin exteral electrode product ZIP: 0.2MB
GCH For implantable medical devices ZIP: 0.2MB
GRT Meet AEC-Q200 for infotainment ZIP: 0.5MB