Wire-bondable or embedded low profile capacitor down to 100µm
Thanks to the unique Murata* Silicon capacitor technology, most of the problems encountered in demanding applications can be solved. The wire bondable or embedded low profile Silicon Capacitors are available with thicknesses of 100µm (down to 80µm on request) and are the most appropriate solution for embedded applications, when designers are looking at utmost decoupling behaviours. EMSC are optimized for laminate substrate package, rigid / flex PCB, FR4, ceramic, glass, leadframe or foil platforms. The Silicon capacitor technology offers a capacitor integration capability (up to 250nF / mm²) which allows downsizing compared with existing solutions. The Murata technology features high reliability, up to 10times better than alternative capacitor technologies, such as Tantalum or MLCC, and eliminates cracking phenomena. Silicon Capacitor technology also offers a very stable capacitor value over the full operating voltage & temperature range, with a high and stable insulation resistance. This Silicon based technology is ROHS compliant and can be compatible with lead free reflow soldering process.
*Murata Integrated Passive Solutions