Ceramic Capacitors FAQ


Do you take any precautions related to adhesive setting before flow soldering of
chip multilayer ceramic capacitors?

Insufficient curing of the adhesive can cause chips to disconnect during flow soldering and deterioration in the insulation resistance between the outer electrodes due to moisture absorption.
Control curing temperature and time in order to prevent insufficient hardening.

Please check below for another Caution and Notice.

Caution/Notice MLCC for automotive (PDF)

<Related FAQ>
What precautions are in order regarding application of adhesive before flow soldering of chip multilayer ceramic capacitors?

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