The soldering conditions for them are as follow.
When melted solder touches to the base of leaf terminal, a part of plastic case shall be melted and it may cause electrical failure.Use a single-sided PCB.
Soldering conditions
1. Flow soldering conditions for Pin terminal type
- Temperature:260±5ﾟC max.
- Time:10±1 sec. max.
- Soldering part is the lead terminals excluding 1.5mm from product body
2. Soldering condition by soldering iron for Pin terminal type
- Temperature:350±5ﾟC max.
- Time:3.0±0.5 sec. max.
- Soldering part is the lead terminals excluding 1.5mm from product body
3. Soldering condition to solder the lead wire to printed circuit board by soldering iron
- Temperature:350±5ﾟC max.
- Time:3.0±0.5 sec. max.
4. Reflow soldering condition for surface mounting type
- Temperature profile:Figure1
- Number of Times:2times max.
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| Figure1
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