Silicon Capacitors

シリコンキャパシタ
Murata high-density silicon capacitors are developed with a semiconductor MOS process and are using the third dimension to substantially increase the capacitor surface and thus its capacitance without increasing the capacitor footprint. Murata silicon technology is based on a monolithic structure embedded in a monocristalline substrate (single MIM and multi MIM - Metal Insulator Metal).

Higher performance in a smaller package
This advanced 3D topology gives a developed area equivalent to 80 ceramic layers in an amazing 100 µm thickness (lower value on request) of active capacitance area. Thanks to a very linear and low dispersive dielectric, miniaturization, capacitance value and electrical performances are optimized.

Market segments addressed
Networking (RF power and broadband), high reliability, medical, automotive and communications.
     
  [Video] Murata 3D Silicon Capacitors

Murata Icon X Product Lineup

ATSC Series

LPSC Series

ETSC / EXSC Series

MGSC Series

UBEC / BBEC / ULEC Series

WLSC Series

UWSC Series

XBSC / UBSC / BBSC / ULSC Series

See all

WBSC / WTSC / WXSC Series

UESL Series

EMSC Series

HTSC / XTSC Series

HSSC Series

Murata Icon X Selection Guide

Selection Guide of Silicon Capacitors
  Thickness Standard
(150℃)
High temp. High freq. Low ESL

Solder
Mounting
85µm       UESL
(down to 10pH)

100µm LPSC
 
  XBSC (100GHz+)
UBSC (60GHz+)
BBSC (40GHz)
ULSC (20GHz)

 
400µm HSSC
HTSC (200℃)
XTSC (250℃)

 

Wire-bonding
vertical
100µm WLSC
 
  UWSC (26GHz+)
(down to 10pH)

 
250µm WBSC
 
WTSC (200℃)
WXSC (250℃)


Wire-bonding
/Embedded
100µm EMSC


MGSC
  UBEC (60GHz+)
BBEC (40GHz)
ULEC (20GHz)

 
250µm   ETSC (200℃)
EXSC (250℃)



ATSC (200℃)
   
Target application
Automotive

BroadBand
  Power Amp for RF
High Reliability
  Medical
  RFID
Signal Integrity
  All applications
 

Murata Icon X Technical Reference

The Murata Silicon Technology is one of the fastest growing technologies offering highly flexible integration of passives such as High-Q inductors, resistors, planar MIM capacitors and trench MOS capacitors for baluns, PLL loop filtering, low pass filtering, RC filtering, supply line decoupling, etc.

This technology provides a fully MOS compatible back-end technology for a full passive integration platform that can be further hetero-integrated Multiple-Chip-Module or flip-chip with other technologies (CMOS, MEMS, etc.) in a SIP.

Murata Icon X PDF Catalog

PDF documents related to silicon capacitors can be downloaded below

Silicon Capacitors

3D Silicon Capacitors (PDF: 5.0 MB)

  • UPDATE 2018/01/29
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