While AI compute creates intelligence, Murata provides the compact components and clean power that enable agentic AI to move beyond computation to interact with the physical world. At Hot Chips 2026, taking place August 23-25 in Palo Alto, California, Murata will showcase the technologies powering AI at the last millimeter - where performance, efficiency, and reliability matter most.
As AI infrastructure advances, Murata is enabling the foundational technologies that make them possible, including solutions for advanced semiconductor packaging, high-density power delivery, high-speed connectivity, and next-generation computing platforms. These innovations enable customers to deliver more capable, efficient, and intelligent AI systems in increasingly compact designs. With that, Murata will demonstrate how its advanced electronic components and power technologies help customers overcome power, thermal, and space constraints of next-generation AI infrastructure. These applications span mobility, industrial automation, MedTech, AgriTech, robotics, data centers, and other high-growth markets.
Visit Murata booth to discover how compact components that deliver clean power and infinite intelligence are powering the future of agentic AI at the last millimeter. For more information about Murata’s participation at Hot Chips 2026, visit the company’s event page here.
Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world.