相关术语:硅电容器、硅IPD、出货方式、最小包装单位、卷带和卷轴(T&R)、窝伏尔组件(WP)、薄膜框载体(FFC)、晶圆、垫片、精加工、电镀、电极,安装、金(Au)、铝(Al)、镍(Ni)、Silicon Capacitor (Si-Cap)、Silicon IPD (Si-IPD, Integrated Passive Device)、Packaging, compact packaging unit, tape and reel (T&R), waffle pack (WP), film frame carrier (FFC), wafer, pad, finishing, plating, electrode, mounting, gold (Au), aluminum (Al), nickel (Ni)