Proposal of New Tape Packaging | Capacitors | Murata Manufacturing Co., Ltd.

Capacitors
Noise Suppression Products/EMI Suppression Filters
Inductors (Coils)
Resistors
Resonators
Filters for Audio Visual Equipment
Filters for Communication Equipment
RF Components/Modules
Sensors
Thermistors
Power Supplies
Sound Components
Micromechatronics
Ceramic Applied Products

Proposal of New Tape Packaging

Bulk Pouch

Proposal of the new bulk packaging "Bulk Pouch" to meet needs of high-density surface mounting

Purpose of the Development

Advantage of the Bulk Pouch

How to Use the Bulk Pouch

Applicable Chips

Embossed Tape

Proposal of the new tape packaging "Embossed Tape" to meet needs of the new surface mounting W4P1

Advantage of the Embossed Tape "W4P1"

Environmentally Friendly

Space Efficiency

Clean Mounting Process

Mounting Stability

Applicable Chips

Bulk Feeding System

Description of the advantages of Bulk Feeding System

Chip Components Applicable to the Bulk Feeding System

Global Environmental Protection

Increased Productivity

Reduced Storage Space

Precautions on Using the Bulk Feeding System

Introducing the Bulk Feeding System

Circuit Designs Best Suited to Bulk Feeding

Capacitors

Technical Articles

Selection Guides

Technical Guides

Proposal of New Tape Packaging

Home > Products > Capacitors > Proposal of New Tape Packaging

Copyright © Murata Manufacturing Co., Ltd. All Rights Reserved.