Proposal of New Tape Packaging | Capacitors | Murata Manufacturing Co., Ltd.

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Home > Products > Capacitors > Proposal of New Tape Packaging

Proposal of New Tape Packaging

Proposal of New Tape Packaging

New Product Information

New product information on the featured Murata capacitors.
Murata is challenging product development to meet customer needs.

New Product Information

Examples of Problem Solving

Solving customers' problems.

Examples of Replacements

Proposal for Cost Reductions

Other Examples of Problem Solving

Examples of Noise Countermeasures

Industry Pickup

Pickup of industries attracting attention! Introducing the recommended series and the latest information on Murata for each industry.

Automobile

Smart Phones

Other Industry Application Guides

Bulk Pouch

Proposal of the new bulk packaging "Bulk Pouch" to meet needs of high-density surface mounting

Purpose of the Development

Advantage of the Bulk Pouch

How to Use the Bulk Pouch

Applicable Chips

Embossed Tape

Proposal of the new tape packaging "Embossed Tape" to meet needs of the new surface mounting W4P1

Advantage of the Embossed Tape "W4P1"

Environmentally Friendly

Space Efficiency

Clean Mounting Process

Mounting Stability

Applicable Chips

Bulk Feeding System

Description of the advantages of Bulk Feeding System

Chip Components Applicable to the Bulk Feeding System

Global Environmental Protection

Increased Productivity

Reduced Storage Space

Precautions on Using the Bulk Feeding System

Introducing the Bulk Feeding System

Circuit Designs Best Suited to Bulk Feeding

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