After mounting capacitors, cracks can occur due to bending the substrate. To prevent cracks, PCB should be designed so that products are not subjected to the mechanical stress caused by warping the board.
- The direction of stress of substrate and on-board products:
Locate the products horizontal to the direction in which stress acts.
- Setting up the capacitors around a substrate break:
Choose a mounting position that minimizes the stress imposed on the capacitor during flexing or bending of the board.