For PKLCS series, a baking process is not necessary due to MSL1.
For PKMCS series, a baking process is not acceptant.
PKMCS series packed in the moisture-proof bag (dry pack) with the Humidity. Indicator Card and Caution Label are sensitive to moisture. The following treatment is required before applying re–flow soldering, to avoid reliability degradation caused by thermal stress. When unpacked, store the component in an atmosphere of below 30ﾟC and below 60% R.H., and solder within one year.