On-Demand Webinar
Murata SPEAKS Webinar Series (SEASON )

Title :	Transformation from Chip to Core : Scaling AI Systems with Advanced Packaging, PDN Design, and Chiplet Integration
Presenters :	Ivy Lee - Sales Executive Koy Han Ren - Strategic Marketing | Data Center & Environment
Date :	16th April 2026 (Thursday)

		Presentation Slides
		Q&A

         

Murata Solutions Across AI/HPC System Architecture
Technology guide to enhance power stability in AI-driven data centers
		What’s covered?: • Market overview for AI servers in data centers • Key technology trends and challenges in power delivery • Component solutions for data centers and IC packaging • Thermal management technologies and solutions • Dedicated design resources and simulation support
Murata Data Center

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