Ceramic Capacitors FAQQWhen implementing a shear test, what kind of destructive mode will occur?

The destructive mode in a shear test will be "electrode peeling" or "damage to the ceramics."
Generally, when the chip size is smaller the shear strength also becomes smaller; therefore, electrode peeling becomes the main destructive mode. When the chip size is larger, the shear strength also becomes stronger, which damages the ceramics.
Since the volume of solder attached to the substrate basically affects the shear strength, if the volume of solder is reduced to a minimum, such as for fillet-less mounting, we recommend that the shear strength be sufficiently evaluated.

In the case of GRM Series, we specify the test contents and specifications, based on "JISC5102-1994" or "JISC5101-1-1998" as the specifications and test methods.
In these standards, the specified bonding value is indicated as "5N/retention time 10+/-1 sec"; however, the ability of the actual bonding changes depending on the chip size.

In our company, the following values have been set as the specifications.
0402(01005) in mm(inch) size : 1N
0603(0201) size : 2N
1005(0402)/1608(0603) size : 5N
Other than the above : 10N

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