New Release of a Passive Design Pack for IC of Qualcomm

7/4/2019

Summary

Murata Manufacturing Co., Ltd. has released a passive design pack to support the Qualcomm QCC5100 series Bluetooth Audio SoCs reference design.
The pack provides the necessary passive components required in one package when using the QCC5100 series for reference design. This includes capacitors, inductors, RF filters and crystals products in one place which will significantly reduce the effort to procure components by designers.

These components featured have been verified with the Qualcomm QCC5100 series and alternative case size components are also available from Murata to tailor for different applications.

The latest QCC5100 series is designed for compact, feature-rich wireless earbuds, headsets and speakers. Power consumption can be reduced by up to 65% compared to the previous generation and devices are optimised to support longer audio playtime in different operating modes.
As a suggestion from Murata, the pack also bundles various miniature products that are ideal for wireless earphones and other miniaturized applications. Going forward, the company plans to continue developing its line-up of support tools for designers in the Bluetooth® audio market.

Passive Design Pack


Murata in Brief

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world. For more information, visit Murata's website at www.murata.com