Vibration Sensor Devices FAQ QWhat is the recommended reflow profile for the vibration sensor devices?

Temperature profile of standard reflow soldering
Temperature profile of standard reflow soldering Pre-heat conditions	150 ⇛ 200°C 60 to 150s
Heating conditions	More than 220°C 20 to 60s
Peak temperature	245±10°C

Precautions

This product is designed on the premise of reflow solder mounting, and should not be joined by hand soldering or with conductive adhesives.
Be sure to mount this product on a printed circuit board using a standard land pattern. If used by any other implementation method, performance is not guaranteed.
If this product becomes high temperature beyond the limit even once, it loses piezoelectric properties and becomes non-functional.
This product is easily affected by humidity, so we cannot recommend any washing. Please note that if you clean it, you will use it within the scope of your company's responsibility.

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Vibration Sensor Devices FAQ QWhat is the recommended reflow profile for the vibration sensor devices?

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