Ceramic Capacitor0402 (01005) in mm (inch) supported. Narrow pitch emboss taping (Width: 4mm, Pocket pitch: 1mm)

Proposal of the new tape packaging "Embossed Tape" to meet the needs of the new surface mounting W4P1

W4P1 Embossed Tape "W4P1" cuts the usage of packaging materials down to 1/4 the surface area ratio compared to W8P2 paper tape of the same chip size. This enables a drastic reduction of taping material waste in mounting. In addition, it contributes to a reduction of transportation energy and carbon dioxide emissions by reducing the packaging size.

The Embossed Tape "W4P1" has a reduced tape width and pitch size compared to W8P2 paper tape of the same chip size, providing for efficient use of tape area. This drastically reduces storage/stock space for chip components.

When chip components are fed into the mounting machine using paper tape, fluff and dust from the tape may cause defects in solder joint of ultra-small components. Embossed Tape, made of plastic, prevents this problem and allows for mounting of ultra-small chip components in a clean area, providing the flexibility to meet various board mounting requirements.

Since the embossed tape causes less fluff and dust compared to the existing paper tapes, it improves clearance of cavity. This may solve pick-up problems on the mounting machine.

Since Embossed Tape W4P1 causes no fluff and dust in packaging, it prevents the suction nozzle from clogging in the mounting process. This allows constant and stable suction of chips without frequent maintenance of the suction nozzle.

Embossed Tape is treated for electrostatic-resistance to prevent electrostatic charges that might occur when the cover tape is peeled-off for mounting. This enables reduction of pick-up problems for the mounting machines, as well as reducing risk of ESD destruction of the semiconductors.

Since Embossed Tape faces less variation in pocket size caused by the environment (temperature, humidity), clearance in a pocket is stable. This gives higher durability of the Embossed Tape when kept in storage under high temperature/high humidity, and contributes to a reduction of pick-up problems when mounting.

Pocket size variations were measured after leaving for one day under high temperature/high humidity condition (70°C/85%).

Embossed tape spec can be applied 0402 (01005) in mm (inch) , as the packaging standards.