New Release of a Passive Design Pack for IC of Qualcomm

2019-07-01

Summary

Murata Manufacturing Co., Ltd. has released a passive design pack to support the Qualcomm QCC5100 series Bluetooth Audio SoCs reference design.
The pack provides the necessary passive components required in one package when using the QCC5100 series for reference design. This includes capacitors, inductors, RF filters and crystals products in one place which will significantly reduce the effort to procure components by designers.

These components featured have been verified with the Qualcomm QCC5100 series and alternative case size components are also available from Murata to tailor for different applications.

The latest QCC5100 series is designed for compact, feature-rich wireless earbuds, headsets and speakers. Power consumption can be reduced by up to 65% compared to the previous generation and devices are optimised to support longer audio playtime in different operating modes.
As a suggestion from Murata, the pack also bundles various miniature products that are ideal for wireless earphones and other miniaturized applications. Going forward, the company plans to continue developing its line-up of support tools for designers in the Bluetooth® audio market.

Passive Design Pack


무라타에 대해서

주식 회사 무라타 제작소는 기능성 세라믹을 기반으로 전자 디바이스의 연구 개발 • 생산 • 판매를 행하고 있으며, 재료부터 제품까지 일관 생산 체제를 구축하고 있습니다. 또한, 무라타 제품의 90%이상은 해외에서 판매되고 있으며, 국내외로 글로벌 회사를 전개하고 있습니다.