Sitemap

Capacitor

• Polymer Aluminum Electrolytic Capacitors
• Single-Layer Microchip Capacitors
• Variable Capacitors
• High Temperature Film Capacitor for Automotive

Inductors

• Inductors for audio line noise suppression

Noise Suppression Products / EMI Suppression Filters / TVS Diodes (ESD Protection Devices)

Resistors

Thermistors (Temperature Sensors)

Sensors

Timing Devices (MEMS Resonator / Crystal Unit / Ceramic Resonator)

Quartz Devices

Sound Components (Buzzer)

Power Products

Batteries

Micro Mechatronics

RFID Products

Matching Devices

Balun

Coupler

Filters

Phase Shifter

RF Switch

Front End Module

SAW Components

Connectors

Antennas

Connectivity Modules

Ionizers / Active Oxygen Module (Ozonizers)

Base Stations

CPE (FWA device)

G-PON (Gigabit passive optical network)

Routers & Switch

Automotive - Electrified

Automotive - Connected

Automotive - AD/ADAS

Automotive - Body/Chassis/Safety

Other Mobility

Data Center & Enterprise Computing

Factory Automation

Security & Building Automation

Smart Grid Infrastructure

Personal Healthcare Devices

Devices for Hospitals

Smart Phone

Wearable & Hearable

PC & Tablet PC

Home Appliance

Design Support Software SimSurfing

• Design Support Software SimSurfing Online Version
• Design Support Software SimSurfing Download Version
• SimSurfing videos
• About the SimSurfing characteristics viewer
• About the SimSurfing selection tools

Design Support Data

• S-Parameter
  • Multilayer Ceramic Capacitors(MLCC)
  • Lead type ceramic capacitors
  • Inductors (coils)
  • Ferrite Beads
• SPICE Model
  • Multilayer Ceramic Capacitors
  • Lead Type Ceramic Capacitors
  • Inductors (Coils)
  • Ferrite Beads
• EDA Library
  • Analog Devices LTspice®
  • ANSYS® Electronics Desktop Circuit Simulator
  • Cadence® AWR Design Environment (Microwave Office)
  • Cadence® OrCAD Capture/PSpice
  • Cadence® Spectre
  • Keysight PathWave Advanced Design System
  • Keysight PathWave RF Synthesis(Genesys)
  • SIMetrix Technologies SIMetrix/SIMPLIS®
  • Synopsys HSPICE®
  • Multilayer Ceramic Capacitors - LPB C-Format
  • Inductors (coils) - LPB C-Format
• CAE data
  • RF Inductors - 3D CAE Data (for ANSYS® HFSS)
• CAD data
  • Multilayer Ceramic Capacitors - 3D CAD Data
  • Inductors (Coils) - 3D CAD Data
  • Multilayer Ceramic Capacitors - Footprint Data

Design Support Tool Help

Contact Information

FAQs

• Capacitors FAQ
• Inductors FAQ
• Noise Suppression Products / EMI Suppression Filters / TVS Diodes FAQ
• Thermistors FAQ
• Sensors FAQ
• Timing Devices FAQ
• Micro Mechatronics FAQ
• LPWA FAQ
• WiFi Bluetooth Modules for NXP i.MX
• Ionizers / Active Oxygen Module (Ozonizer) FAQ
• Digital Panel Meters FAQ

Library

• PDF Catalog Library
• Selection Guides

Reference Design

• Nordic Semiconductor
• Dialog Semiconductor
• Qualcomm

Stock Check

Product Information Management API Service

• API usage application

Health and Safety Compliance

• Murata's approach for EU RoHS
• Murata and REACH Regulation(EU)
• Murata’s approach for California Proposition 65

Avoiding Counterfeit Products

Restriction of Weapons of Mass Destruction and Conventional Weapons

2021 차세대 부품 소개 라이브

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온 디멘드 웨비나 5G: 시장에서 성공하기 위한 컴포넌트 레벨에서의 리스크 관리

Fast-track your wireless IoT production With Cypress & Murata

How Murata is changing the power density paradigm – Part 1

How Murata is Changing the Power Density Paradigm - Part 2

OCP Power for Edge Computing – Demystified Flexible Power Solutions for Edge & Hyperscale Computing

어플리케이션 가이드 : 5G - 기지국