Multi-layer LCP productULTICIRC

ULTICIRC is the world’s first LCP flexible substrate that utilizes an inner cavity. It achieves an ultra-low Dk below Dk 2.0 by incorporating an inner cavity in the substrate to significantly reduce loss. We expect ULTICIRC will play a role in settings that require even higher speeds and lower loss in the smartphone, communication, and other fields.

In a simulation with a stripline structure, ULTICIRC demonstrated significantly improved insertion loss compared to conventional LCP flexible substrates (Multi-layer LCP products), as shown below.

Using the same batch lamination technology as conventional LCP products, ULTICIRC features excellent airtightness and low moisture absorption.
It is compatible with reflow processes and prevents delamination or performance degradation.

It is said that we will see an increase in the need for flexible substrates with excellent IL characteristics in the high-frequency range due to the addition of the FR3 and 6G bands in the near future. We have advanced development aiming to further improve characteristics based on our LCP flexible substrates (Multi-layer LCP products) that exhibit excellent characteristics in the high-frequency range. We have now been able to reach the stage of mass production.

Previously, there was an issue in that the thinner a high-frequency flexible substrate was, the greater the loss became. However, we have solved that with this product by achieving ultra-low loss to enable both maintenance of characteristics and thinness. Created by combining an LCP flexible substrate with an inner cavity, this product achieves a much lower dielectric constant than conventional structures. This will contribute widely to meeting needs for even higher speed communication and thinner and smaller products.

In terms of the shapes we provide, all our products are custom-made except for UWB antennas. Please feel free to contact us with questions or inquiries about our products.