Multi-layer LCP product is composed of two core technologies. These are Murata's core multilayer laminated technologies developed for MLCCs and a unique high-performance resin material.
Multi-layer LCP product was created through the deep collaboration of these two technologies.
As a result of these two technologies, you can manufacture not only a substrate, but also transmission lines and other components for smart phones and tablet devices, as well as composite components that combine antennas and matching circuits with Multi-layer LCP product.
Prepare the required number of layers of resin and copper foil-bonded sheets and then press them together at one time. The adhesive that has traditionally been used in resin substrates to adhere the sheets is not required in this step. As a result of this process, we are able to resolve many problems that were a challenge with the previous resin substrates.
Compared to the materials used in previous resin substrates (Glass Epoxy Substrate, FPC, etc.), the high-performance resin material possesses a smaller relative dielectric constant (εr), loss tangent (tanδ), and absorption rate.