Murata's MEMS resonators use silicon materials that have high affinity with the IC, and realization of the world's smallest size enables embedding in the IC.
By embedding a 32k resonator in the IC, this eliminates the need for resonator technical support by the IC manufacturer, and helps to simplify the circuit at the end customer.
The wafer level chip scale package (WLCSP) uses silicon materials that have high affinity when mounting with a semiconductor IC chip made of the same material. In addition, a profile 30% lower than that of a conventional crystal resonator realizes a product height of just 0.35 mm. This enables embedding in the IC.
Murata's 32 kHz resonator has a WLCSP structure using silicon materials that provides excellent molding pressure resistance.
This enables to reduce package displacement during molding to approximately 1/100 that of a conventional crystal resonator, and high -pressure transfer molding can also be supported.
Molding simulation results
[Simulation conditions] Molded resin: epoxy, molding pressure: 19 MPa