1. Designed specifically for wire bonding and use of gold-tin (AuSn) solder
The gold-plated external electrodes make these devices suitable for wire bonding or use of gold tin (AuSn) solder.
2. Ideal for mounting in packages, such as optical communication related devices , IC and etc.
Noise can be reduced by eliminating the routing of the wire, and high efficiency can be achieved with a built-in capacitor in the package, such as TO-CAN, IC and etc. by wire bonding mounting.
3. Contributes to the miniaturization of the set.
Murata offers a lineup of small size products, such as the 0603 (0201) and 1005 (0402) in mm (inch).