CeramicCapacitorGR4 Series

  • Complied with RoHS
  • REACH
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    Chip Multilayer Ceramic Capacitors for Splitter Circuit of G-Fast, xDSL for Consumer Electronics & Industrial Equipment

    Size 3.2x2.5mm / U2J Char. / DC630V
    Meet with ITU-T K.20 Standard (Impulse Test: 1.5kV, 10x700usec, 10 times (+/-) )

    Specific Applications

    For the detail of specific applications, please refer to the following links or specification sheets.
    Specific Applications Details
    Precautions for use

    Consumer equipment Industrial equipment Automotive infotainment/comfort equipment Automotive powertrain/safety equipment Medical equipment [GHTF A/B/C]
    except for implant equipment
    Implanted medical equipment or medical equipment [GHTF D]

    Features

    1. For Splitter Circuit of G-Fast, xDSL

    Ex) DPU Ex) Splitter circuit

    2. Realized large capacity and small size while maintaining high withstand voltages by the multilayer structure.

    Example of Structure

    3. Dedicated for reflow soldering.

    Specifications

    Size(mm) 3.2x1.6mm - 3.2x2.5mm
    Rated Voltage 630Vdc
    Capacitance 1000pF - 15000pF
    Main applications Splitter Circuit of G-Fast, xDSL

    Lineup

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