MEMS Resonator

Size (LxWxT):0.9 x 0.6 x 0.3(in mm)

Murata’s MEMS resonators are piezoelectric elements that function as mechanical resonators to generate a constant frequency.

MEMS technology was used to realize the world’s smallest size resonator with very low ESR characteristics that is currently unachievable by quartz crystal resonators. Murata’s MEMS resonators achieves excellent frequency accuracy and stable temperature characteristics without the use of active elements to correct the initial frequency and frequency shift by temperature. This helps customers reduce both power consumption and mounting space.

Application Guide
Suitable for a variety of applications such as miniature low-profile devices, industrial equipment, lighting, and incorporation into ICs.
Ceramic Resonator

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Recommendable Part Number

Click a part number to browse detailed specifications, characteristic data, packaging data, and other information. You can request free samples on murata's website or search for stock of specific part numbers at Murata authorized agents, distributors and trading companies.

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Part Number Data
Temperature Range
Shift by Temperature
Equivalent Series
WMRAG32K76CS1C00R0 Open PDF file -30 to
±20ppm -150 to
+10 ppm
8pF 75kΩ
WMRAG32K76CS2C00R0 Open PDF file -40 to
-200 to
+10 ppm
WMRAG32K76CS3C00R0 Open PDF file -40 to
WMRAG32K76CS4C00R0 Open PDF file -40 to
-270 to
+10 ppm
  • *When considering replacement from a crystal resonator, note that the load capacitance value differs for crystal resonators and MEMS resonators.

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Murata's world smallest MEMS resonator saves space and is able to withstand temperatures up to 125°C.

Main Feature

High reliability under high temperatures

The device supports high reliability especially in high temperature conditions because it does NOT utilize organic adhesives inside of the package.
For this reason, this device can be used in applications where good high-temperature performance is required, such as in industrial equipment and lighting.

HAST*/PCT** Test Result
[Test condition]Temperature: 120℃, Humidity: 85%, Air pressure: 1.7atm

  • *High Accelerated Stress Test
  • **Pressure Cooker Test

Space saving

This product realizes an ultra-compact chip scale package (CSP) that incorporates the necessary load capacitance for the oscillation circuit. This enables a reduction in the total oscillation circuit space needed, which helps to reduce the final set size.
In addition, the open space can also be used to increase the battery size or add other functions.

Ceramic Resonator

Embedding supported

The wafer level chip scale package (WLCSP) uses silicon materials that have high affinity when mounting with a semiconductor IC chip made of the same material. This enables embedding in the IC.

Transfer molding and wire bond mounting can also be supported.

Low power consumption

The low ESR characteristics can be utilized to lower the IC gain.
This enables a reduction in the current consumption of the oscillation circuit and the power consumption of the overall set.

Ceramic Resonator
  • *Compared with our products


Application Guide

Application Guide of MEMS Resonator

Application Support

Advantages of MEMS Resonator for each applications, and product selections, related documents.

Technical Reference

Please see your required information on operating of our products.

PDF Catalog

PDF catalogs for MEMS Resonators are available at the following links:

MEMS Resonator

MEMS resonator for Consumer & Industrial (PDF: 1.0 MB)


Product Lineup of Timing Devices (PDF: 0.5 MB)


Timing Devices IC Matching Service Information (PDF: 0.6 MB)


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