1. Bond metal terminals to the external electrodes of chips.
The stress applied to the chip is relieved by the elastic action of the metal terminal.
2. Substantially reduces noise, board deflection cracks and soldering cracks.
This product is not damaged even with a board deflection of 6 mm.
Solder cracks do not occur even with 2,000 cycles of heat stress.
3. 2 chips can be stacked.
Realize large capacity by stacking 2 capacitors.